Microfluidic In-Chip Cooling

TNO has developed the MicroFluidic In-Chip Cooling platform, a cutting-edge technology that cools chips from within using evaporation in microscopic fluid channels, delivering up to 500 times more cooling power than conventional methods. This innovation not only enhances chip performance and reliability by addressing extreme thermal loads in AI and data centre applications but also recovers up to 80% of the extracted heat for reuse in other sectors, promoting energy efficiency and sustainability. Demonstrated in telecom and AI hardware and supported by strong patents and industry collaborations, this technology represents a significant advancement towards smarter, greener electronics.

Person in front of MicroFluidic In-Chip cooling platvorm

MicroFluidic In-Chip Cooling

Computing power continues to surge driven by significant increase in artificial intelligence, high-performance data centres and advanced semiconductor applications, so does the heat generated by the chip that power these systems. Traditional cooling methods, such as air and direct liquid cooling, are no longer sufficient for the extreme thermal loads. They struggle to keep up with the intense thermal loads generated by modern central processing units, graphical processing units and server boards. This limitation threatens not only performance, but also energy efficiency across the data centre industry, where every watt counts.

Cooling Where It Counts

To tackle this challenge, TNO has developed a breakthrough/disruptive solution, the MicroFluidic In-Chip Cooling platform. This technology uses evaporation in microscopic fluid channels to cool the chip from within. By placing these channels directly inside the chip and its heat-spreading lid, the system delivers up to 500 times more cooling power than conventional methods. This approach brings the cooling right at the heat source, boosting performance and reliability.

Beyond Cooling

What makes TNO’s solution even more promising is its ability to recover heat. Up to 80% of the heat extracted from the chip can be reused for other applications, such as district heating. This turns a technical challenge into an opportunity for energy efficiency and sustainability. With successful demonstrations in telecom and AI hardware, including a 5G driver chip where microchannels were etched directly into the chip’s top layer, and collaborations with industry leaders like DELL and LeGrand, TNO is paving the way for a new era of efficient and sustainable chip cooling.

Innovation with Impact

TNO’s MicroFluidic In-Chip Cooling is not just a technical innovation—it’s part of a broader vision for smarter, greener electronics. With a strong patent portfolio, strategic funding, and alignment with TNO’s High Tech Industry mission, the project is moving forward with confidence. This project exemplifies how we combine scientific excellence with societal relevance. The team includes experts in microfluidics, thermal engineering, and semiconductor design, and is actively exploring partnerships and spin-off opportunities to bring this technology to market.

Could this technology benefit your market position? Contact us for investment and/or development opportunities.